I-SV Thermal Conductive Two Component 1:1 electronic potting compound I-Sealant ye-Junction Box

Incazelo emfushane:

I-SV electronic potting compound i-Sealant iklanyelwe ukubumba futhi ingangeni manzi kumshayeli we-LED, ama-ballast, nezinzwa zokupaka ezihlehlayo.

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Incazelo Yomkhiqizo

IZICI

1. I-viscosity ephansi, i-fluidity enhle, ukuchithwa kwe-bubble okusheshayo.

2. I-insulation kagesi enhle kakhulu kanye nokushisa ukushisa.

3. Kungaba ibhodwe elijulile ngaphandle kokukhiqizwa kwezinto eziphansi zamangqamuzana ngesikhathi sokuphulukiswa, kunokuncipha okuphansi kakhulu nokunamathela okuhle kakhulu ezingxenyeni.

UKUPAKASHA
A:B =1:1

Ingxenye: 25KG

Ingxenye B: 25 KG

UKUSETSHENZISWA OKUYISISEKO

1. Ukubhoda kanye nokungangeni kwamanzi kumshayeli we-LED, ama-ballast, nezinzwa zokupaka ezihlehlayo.

2. I-insulation, conduction thermal, umswakama-proofing, kanye nemisebenzi yokulungisa ezinye izingxenye ze-electronic

IZIMPAHLA EZIJWAYELEKILE

Lawa manani awahloselwe ukusetshenziswa ekulungiseleleni imininingwane

IMPAHLA	A	B
Ngaphambi Kwengxube	Ukubukeka	Emhlophe	Mnyama
(25℃,65%RH)	I-Viscosity	2500±500	2500±500
	Ukuminyana (25℃, g/cm³)	1.6±0.05	1.6±0.05
Ngemva Kokuxutshwa	I-Proportion Ratio (Ngesisindo)	1	1
(25℃,65%RH)	Umbala	Okumpunga
	I-Viscosity	2500 ~ 3500
	Isikhathi sokusebenza (imizuzu)	40-60
	Isikhathi Sokwelapha (H, 25℃)	3~4
	Isikhathi Sokwelapha (H, 80℃)	10~15
Ngemva Kokuhlinzwa	Ukuqina (Shore A)	55±5
(25℃,65%RH)	Amandla Okuqina (Mpa)	≥1.0
	I-Thermal Conductivity (W/m·k)	≥0.6~0.8
	Amandla e-Dielectric (KV/mm)	≥14
	I-Dielectric Constant (1.2MHz)	2.8~3.3
	Ukungazweli Ivolumu (Ω·cm)	≥1.0×1015
	I-Coefficient Of Linear Expansion (m/m·k)	≤2.2×10-4
	Izinga Lokushisa Lokusebenza (℃)	- 40 ~ 100