I-SV Thermal Conductive Two Component 1:1 electronic potting compound Sealant ye-Junction Box

Incazelo emfushane:

I-SV electronic potting compound Sealant yenzelwe ukubhoda futhi ingangeni manzi yomshayeli we-LED, ama-ballast, kanye nezinzwa zokupaka ezingemuva.

Sithumelele i-imeyili

Imininingwane Yomkhiqizo

Amathegi Omkhiqizo

Incazelo Yomkhiqizo

IZICI

1. Ukuchachamba okuphansi, ukugeleza okuhle, ukushabalalisa amabhamuza okusheshayo.

2. Ukushisa okuhle kakhulu kanye nokushisa.

3. Ingafakwa ngokujulile ebhodweni ngaphandle kokukhiqizwa kwezinto eziphansi zama-molecule ngesikhathi sokulungiswa, inokuncipha okuphansi kakhulu kanye nokunamathela okuhle kakhulu ezingxenyeni.

UKUPHAKISHA
A:B =1:1

Ingxenye: 25 kg

Ingxenye B: 25 KG

UKUSEBENZISA OKUYISISEKO

1. Ukufaka izimbiza futhi kungangeni manzi komshayeli we-LED, ama-ballast, kanye nezinzwa zokupaka ezingemuva.

2. Imisebenzi yokuvikela ukushisa, ukuhanjiswa kokushisa, ukuvimbela umswakama, kanye nokulungisa ezinye izingxenye ze-elekthronikhi

IZINDAWO EZIJWAYELEKILE

Lezi zindinganiso azihloselwe ukusetshenziswa ekulungiseleleni imininingwane

IMPAHLA	A	B
Ngaphambi Kwengxube	Ukubukeka	Okumhlophe	Okumnyama
(25℃,65%RH)	Ukuthamba	2500±500	2500±500
	Ubuningi (25℃, g/cm³)	1.6±0.05	1.6±0.05
Ngemva Kokuxuba	Isilinganiso Sesilinganiso (Ngesisindo)	1	1
(25℃,65%RH)	Umbala	Okumpunga
	Ukuthamba	2500~3500
	Isikhathi Sokusebenza (iminithi)	40~60
	Isikhathi Sokuphulukisa (H, 25℃)	3~4
	Isikhathi Sokuphulukisa (H, 80℃)	10~15
Ngemva kokwelapha	Ubulukhuni (Ogwini A)	55±5
(25℃,65%RH)	Amandla Okudonsa (i-Mpa)	≥1.0
	Ukushisa Okuphezulu (W/m·k)	≥0.6~0.8
	Amandla E-dielectric (KV/mm)	≥14
	I-Dielectric Constant (1.2MHz)	2.8~3.3
	Ukumelana Nomthamo (Ω·cm)	≥1.0×1015
	I-Coefficient Yokwandiswa Okuqondile (m/m·k)	≤2.2×10-4
	Izinga Lokushisa Elisebenzayo (℃)	-40~100